JPH0377440U - - Google Patents
Info
- Publication number
- JPH0377440U JPH0377440U JP1989138565U JP13856589U JPH0377440U JP H0377440 U JPH0377440 U JP H0377440U JP 1989138565 U JP1989138565 U JP 1989138565U JP 13856589 U JP13856589 U JP 13856589U JP H0377440 U JPH0377440 U JP H0377440U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- container
- parts plated
- chip mounting
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138565U JPH083017Y2 (ja) | 1989-11-29 | 1989-11-29 | 半導体装置の容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138565U JPH083017Y2 (ja) | 1989-11-29 | 1989-11-29 | 半導体装置の容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377440U true JPH0377440U (en]) | 1991-08-05 |
| JPH083017Y2 JPH083017Y2 (ja) | 1996-01-29 |
Family
ID=31685658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989138565U Expired - Lifetime JPH083017Y2 (ja) | 1989-11-29 | 1989-11-29 | 半導体装置の容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083017Y2 (en]) |
-
1989
- 1989-11-29 JP JP1989138565U patent/JPH083017Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH083017Y2 (ja) | 1996-01-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |